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Effect of sintering temperature on electrical and microstructure properties of hot pressed Cu-TiC composites

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dc.contributor.authorBuytoz, S.
dc.contributor.authorKir, D.
dc.contributor.authorIslak, S.
dc.date.accessioned2026-01-02T23:06:03Z
dc.date.issued2014-01-01
dc.description.abstractIn this study, Cu-TiC composites were successfully produced using hot pressing method. Cu-TiC powder mixtures were hot-pressed for 4 min at 600, 700 and 800?C under an applied pressure of 50 MPa. Phase composition and microstructure of the composites hot pressed at different temperatures were characterized by X-ray diffraction, scanning electron microscope, and optic microscope techniques. Microstructure studies revealed that TiC particles were distributed uniformly in the Cu matrix. With the increasing sintering temperature, hardness of composites changed between 64.5 HV0.1 and 85.2 HV0.1. The highest electrical conductivity for Cu-10 wt.% TiC composites was obtained for the sintering temperature of 800?C, with approximately 68.1% IACS.
dc.description.urihttps://doi.org/10.2298/sos1401015i
dc.description.urihttps://doaj.org/article/2a7eb6d89cdf43c98962b8ff639c5b9d
dc.description.urihttps://dx.doi.org/10.2298/sos1401015i
dc.description.urihttps://avesis.kocaeli.edu.tr/publication/details/d6e62ca0-52f5-43a3-8f98-239662e25806/oai
dc.identifier.doi10.2298/sos1401015i
dc.identifier.eissn1820-7413
dc.identifier.endpage21
dc.identifier.issn0350-820X
dc.identifier.openairedoi_dedup___::afe40e9637e5165784d0af59c83e1d66
dc.identifier.orcid0000-0001-9140-6476
dc.identifier.scopus2-s2.0-84899678519
dc.identifier.startpage15
dc.identifier.urihttps://hdl.handle.net/20.500.12597/35784
dc.identifier.volume46
dc.identifier.wos000339449400002
dc.language.isoeng
dc.publisherNational Library of Serbia
dc.relation.ispartofScience of Sintering
dc.rightsOPEN
dc.subjectelectrical conductivity
dc.subjectCu-TiC composites
dc.subjectChemical technology
dc.subjectmicrostructure
dc.subjectTP1-1185
dc.subjectsintering temperature
dc.titleEffect of sintering temperature on electrical and microstructure properties of hot pressed Cu-TiC composites
dc.typeArticle
dspace.entity.typePublication
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