Akkas, M.Atapek, S.H.Polat, S.2024-03-302024-03-302023.01.010350-820Xhttps://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=dspace_ku&SrcAuth=WosAPI&KeyUT=WOS:001187841600001&DestLinkType=FullRecord&DestApp=WOS_CPLhttps://hdl.handle.net/20.500.12597/33038In this study, powder metallurgical Cu-Ni-Si alloys with different Ni:Si ratios are produced by cold pressing sintering (600 MPa, at 950 degrees C for 60 min) and bulk materials are solution annealed at 950 degrees C for 60 min, quenched in water and aged at 450 degrees C for 60 min. A fine distribution of Ni-Si compounds embedded in a netted-free structure is formed in the matrix. Although a conductivity level of at least 22% IACS is achieved in all powder metallurgical alloys, the impurity effect is dominant and a decrease in the conductivity is detected by increasing Ni:Si ratio. However, a slight increase in electrical conductivity is achieved by the precipitation of nickel silicides in the a-Cu matrix under aging conditions. Increasing Ni:Si ratio directly increases the hardness of the powder metallurgical matrix, and a hardness value of 73 HV0.1 is obtained for the aged alloy having the highest Ni:Si (5:1) ratio.eninfo:eu-repo/semantics/openAccessCorson alloyPowder metallurgyConductivityHardnessArticle10.2298/SOS230329026A001187841600001425436554